Technical Product Bulletin
HEAT CURE, SILVER FILLED ELECTRICALLY CONDUCTIVE EPOXY MAXIMUM CONTINUITY OF CONDUCTIVITY
AA-DUCT 904 is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly.
AA-DUCT 904 offers excellent mechanical, electrical, and physical properties at continuous operating temperatures up to 175°C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication.
AA-DUCT 904 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing.
AA-DUCT 904 is a smooth, soft paste that can be applied by hand application, automatic dispensers, screen-printing, transfer or stamping techniques. It is available in both a lower and higher viscosity grade for use in a variety of dispensing equipment and application techniques.
|Hardness, Shore D||83|
|Cure Type||Heat cure|
|Benefits||High strength |
Excellent mechanical, electrical properties
|Substrates||Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, phenolic and G-10 epoxy glass boards.|
|Typical application||microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing.|
|2 hours||@ 125°C|
|1 hour||@ 150°C|
|1/2 hours||@ 175°C|
|Viscosity @ 25 °C cps||200,000|
|Shelf life||6 Months|
|Thermal Conductivity, btu/hr/ft2/°F/in||16.1|
|Coefficient of Thermal Expansion||60x 10^-6 (in/in) C|
|Operating Temperature||-55°C to +175°C |
Intermit. to 325
|Volume Resistivity ohm. cm||< 0.001|
NASA OUTGASSING RESULTS:
|TML (Total Mass Loss)||% 0.38|
|CVCM (Collected Volatile Condensable Materials) %||0.01|
|WVR (Water Vapor Recovery) %||0.07|
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply AA-DUCT 904 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.