AA-DUCT GS1 Silver Glass Sphere Coated., Electrically Conductive Epoxy Adhesive

$14.99 - $649.99
SKU:
AA-DUCT GS1
Technical Product Bulletin

Dense SILVER EPOXY ELECTRICAL BONDER


PRODUCT DESCRIPTION:

AA-DUCT GS1: represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated glass spheres for low compaction resultingin better desnity adversely sacrificing spacial and conductive properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of conventional silver conductive.

AA-DUCT GS1: cures at room temperature or can be accelerated with mild heat to form a tenacious bond between similar and dissimilar substrates such as aluminum, copper, magnesium, steel, bronze nickel, ceramic, glass, phenolic, and G-10 epoxy glass boards.

AA-DUCT GS1, because of its excellent continuity, has been used extensively in such diversified applications as, microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder. This unique formulation offers ease in handling due to its creamy consistency and versatile application by hand, automatic dispenser, silk-screening, transfer or stamping techniques.

PRODUCT PROPERTIES:

Appearance Silver
Cure Type Heat cure or Room temperature
Benefits High strength
Perfect bond
EMI & RFI shielding
Cold Solder
Minimum Bond Line Thickness 1mm
Glass Transition Temp, Tg 50 °C
Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Typical Applications microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder.

UNCURED PROPERTIES:

Viscosity @ 25 °C cps Paste
Silver coated ceramic , % 50 to 75
Pot Life @ RT 1 Hour
Mix ratio, by weight 100:5 / Resin:Hardener
Shelf life 1 Year

CURE SCHEDULE:

15 minutes @ 100°C
30 minutes @ 60°C
24 hours @ Room temperature

CURED PROPERTIES:

Volume Resistivity < 0.0015
Hardness, Shore D 81
Compressive Strength, psi 13,600
Shrinkage Linear, in / in 0.004
Specific Gravity, 25°C / 25°C 2.60
Tensile Strength, psi 8,900
Compressive Strength, psi 13,700

THERMAL PROPERTIES:

Thermal Conductivity, btu / hr / ft2 / °F / in 90
Thermal Expansion Coefficient, (cm / cm / °C • 10-5) 1.9
Heat Distortion, °C 165
Operating Temperature Range, °C -50 to +165

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply AA-DUCT GS1completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.

Data Sheets: TDS | MSDS available upon request.


 

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