Staking Compound

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AA-BOND EP30AN LOW VISCOSITY THERMALLY CONDUCTIVE ELECTRICALLY INSULATING EPOXY COMPOUND

PRODUCT DESCRIPTION: AA-BOND EP30AN is a two part epoxy for high performance potting, sealing, coating and bonding which improve heat transfer while maintaining electrical insulation. This is an alternative better pricedoffset formulation to...

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AA-BOND 2116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing

Technical Product Bulletin LOW VAPOR PRESSURE EPOXY STAKING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics,...

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AA-BOND 2112-BK Rigid Black Epoxy Encapsulation Compound, 2 Part, staking Room Temp or Heat Cure

Technical Product Bulletin RIGID STAKING COMPOUND EPOXY ADHESIVE PRODUCT DESCRIPTION: AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications...

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AA-BOND 2112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure

Technical Product Bulletin RIGID STAKING COMPOUND EPOXY ADHESIVE PRODUCT DESCRIPTION: AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications...