Technical Product Bulletin
Dense SILVER EPOXY ELECTRICAL BONDER
PRODUCT DESCRIPTION
AA-DUCT GS1 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on silver-coated glass spheres for low compaction, resulting in better density without adversely sacrificing spatial and conductive properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of conventional silver conductive adhesives.
AA-DUCT GS1 cures at room temperature or can be accelerated with mild heat to form a tenacious bond between similar and dissimilar substrates such as aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, phenolic, and G-10 epoxy glass boards.
AA-DUCT GS1, because of its excellent continuity, has been used extensively in such diversified applications as microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high-frequency shields, connections, and circuitry, and as a cold solder. This unique formulation offers ease in handling due to its creamy consistency and versatile application by hand, automatic dispenser, silk-screening, transfer, or stamping techniques.
PRODUCT PROPERTIES
| Appearance | Silver |
| Cure Type | Heat cure or Room temperature |
| Benefits |
|
| Minimum Bond Line Thickness | 1mm |
| Glass Transition Temp, Tg, °C | 50 |
| Substrates | Excellent choice for aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic, and G-10 epoxy glass boards |
| Typical Applications | Microwave EMI and RFI shielding, assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high-frequency shields, connections, circuitry, and cold soldering |
UNCURED PROPERTIES
| Viscosity @ 25 °C, cps | Paste |
| Silver-Coated Ceramic, % | 50 to 75 |
| Pot Life @ RT | 1 Hour |
| Mix Ratio, by weight | 100:5 Resin to Hardener |
| Shelf Life | 1 Year |
CURE SCHEDULE
| 15 minutes | 100°C (212°F) |
| 30 minutes | 60°C (140°F) |
| 24 hours | Room temperature (25°C / 77°F) |
CURED PROPERTIES
| Volume Resistivity, ohm·cm | < 0.0015 |
| Hardness, Shore D | 81 |
| Compressive Strength, psi | 13,600 |
| Shrinkage Linear, in/in | 0.004 |
| Specific Gravity, 25°C/25°C | 2.60 |
| Tensile Strength, psi | 8,900 |
| Compressive Strength, psi | 13,700 |
THERMAL PROPERTIES
| Thermal Conductivity, btu/hr/ft²/°F/in | 90 |
| Thermal Expansion Coefficient, (cm/cm/°C × 10⁻⁵) | 1.9 |
| Heat Distortion, °C | 165 |
| Operating Temperature Range, °C | -50 to 165 |
GENERAL INFORMATION
For safe handling information on this product, consult the Safety Data Sheet, (SDS).
HOW TO USE
- Carefully clean and dry all surfaces to be bonded.
- Apply AA-DUCT GS1 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
- Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
- Some ingredients in this formulation may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY
This epoxy can be supplied in various different packages.
Data Sheets: TDS | MSDS available upon request.
