Technical Product Bulletin
NICKEL FILLED ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE
AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 3.8x10-2 ohm-cm.
AA-DUCT 903 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
AA-DUCT 903 has been used extensively in such diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
|Cure Type||Heat cure or Room temperature|
|Benefits||High strength |
Cold solder for high-sensitive components
|Mix Ratio by weight||100:5 / Resin:Hardener|
|Substrates||Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.|
|Minimum Bond Line Thickness||1mm|
|Glass Transition Temp, Tg||50 °C|
|Typical Applications||Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair|
|Viscosity @ 25 °C cps||Paste|
|Specific Gravity, mixed||2.79|
|Reactive solids contents, %||100|
|Pot Life||1 Hour|
|Shelf Life||1 Year|
|Hardness, Shore D||85|
|Shrinkage linear in/in||0.003|
|Tensile Strength, psi||9500|
|Volume Resistivity ohm. cm||< 0.038|
|Compressive Strength, psi||14,000|
|15 minutes||@ 100°C|
|45 minutes||@ 50°C|
|24 hours||Room temperature|
|Thermal Conductivity, btu/hr/ft2/°F/in||9.4|
|Thermal Expansion Coefficient, (cm / cm / °C • 10-5)||1.5|
|Heat Distortions, °C||95|
|Operating Temperature Range, °C||-50 to +170|
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply AA-DUCT 903 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.
Data Sheets: TDS | MSDS available upon request.