AA-DUCT 2902 Epoxy Adhesive Silver 2.65 g Kit Tra-Duct Eccobond 2902 BiPax Offset

$39.99
SKU:
AA-DUCT 2902-2.65
AA-DUCT 2902 Epoxy Adhesive Silver 2.65 g Kit Tra-Duct Eccobond 2902 BiPax Offset

Technical Product Bulletin

AA-DUCT 2902 SILVER CONDUCTIVE EPOXY ADHESIVE

PRODUCT DESCRIPTION

AA-DUCT 2902 is a high-performance, silver-based epoxy adhesive designed for electronics repair, EMI/RFI shielding, and circuitry bonding. With an electrical resistivity of less than 1x10-4 ohm·cm, it offers exceptional electrical and thermal conductivity.

This two-component, solvent-free epoxy cures at room temperature or with heat, providing strong adhesion to substrates like aluminum, copper, steel, ceramics, and G-10 epoxy glass boards. Its operating temperature range of -50°C to 170°C ensures reliability in extreme conditions.

Ideal for electrical modules, printed circuitry, wave guides, flat cables, high-frequency shields, and cold soldering, AA-DUCT 2902 is available in a 2.65g kit. It passes NASA outgassing standards (TML: 0.64%, CVCM: 0.05%) for aerospace applications.

PRODUCT PROPERTIES

Appearance Silver
Cure Type Heat Cure or Room Temperature
Mix Ratio (by weight) 100:6 (Resin:Hardener)
Benefits
  • High electrical conductivity
  • Room-temperature cure
  • High strength
  • Perfect bond
  • Cold solder for heat-sensitive components
  • Solvent-free
  • Thermally conductive
Substrates Aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic, G-10 epoxy glass boards
Operating Temperature -50°C to 170°C
Typical Applications Electronics repair, EMI/RFI shielding, printed circuitry, wave guides, flat cables, high-frequency shields, cold soldering

UNCURED PROPERTIES

Specific Gravity, mixed 2.79
Reactive Solids Content, % 100
Pot Life 1 Hour
Shelf Life 6 months (bi-pax), 1 year (jars/syringes)
Viscosity Paste, 20,000 CPS

CURE SCHEDULE

@ 100°C 15 minutes
@ 65°C 1–4 Hours
@ 25°C 24 Hours

CURED PROPERTIES

Hardness, Shore D 80
Shrinkage, linear (in/in) 0.003
Lap Shear Strength 5 N/mm2 (700 psi)
Volume Resistivity < 0.0001 ohm·cm
Thermal Expansion Coefficient 1.5 x 10-5 cm/cm/°C
Thermal Conductivity 2.99 W/mK
Tensile Strength 9500 psi
Compressive Strength 14,000 psi
Heat Distortion 95°C
Electrical Resistivity < 1x10-4 ohm·cm
NASA Outgassing Passed (TML: 0.64%, CVCM: 0.05%)

GENERAL INFORMATION

For safe handling information, consult the Safety Data Sheet (SDS).

HOW TO USE

  1. Carefully clean and dry all surfaces to be bonded.
  2. Mix AA-DUCT 2902 (100:6 resin:hardener ratio) thoroughly. If crystallized, warm to 52°C for 30 minutes before mixing.
  3. Apply mixed adhesive to surfaces and press together with contact pressure.
  4. Cure at 25°C (24 hours), 65°C (1–4 hours), or 100°C (15 minutes).
  5. Consult the Safety Data Sheet (SDS) for safe handling.

AVAILABILITY

Available in 2.65g kits and various packaging options (bi-pax, jars, syringes). Contact us for bulk orders or custom configurations.

CUSTOMER TESTIMONIALS

James Carter: "Highly conductive and reliable for electronics repair, easy to apply with excellent results."

Emma Wilson: "Perfect for circuit board repairs. The room-temperature cure is a game-changer."

Data Sheets: TDS | SDS available upon request.

FREQUENTLY ASKED QUESTIONS

Can AA-DUCT 2902 cure at room temperature? Yes, it cures in 24 hours at 25°C or faster with heat (15 minutes at 100°C).

What substrates does it bond to? Aluminum, copper, steel, ceramics, glass, phenolic, and G-10 epoxy glass boards.

Is it suitable for aerospace applications? Yes, it passes NASA outgassing standards (TML: 0.64%, CVCM: 0.05%).

What is the shelf life? 6 months in bi-pax, 1 year in jars or syringes at ambient temperature.

Can it be used for EMI shielding? Yes, its high electrical conductivity makes it ideal for EMI/RFI shielding.

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