AA-BOND G298 Gold Epoxy Adhesive, 2 Part, Electrically and Thermally Conductive

$24.99 - $775.99
SKU:
AA-BOND G298

Technical Product Bulletin

 

PRODUCT DESCRIPTION:

AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic high reliability applications.

AA-BOND G298 is non-oxidizing and prevents electromigration.

 

 

PRODUCT PROPERTIES:

 

Color

Part A (Resin): Brown

Part B (Hardener): Clear to yellowish

Cure Type

Room Temperature or Heat cure

Benefits

●        No electromigration

●        Antioxidation

●        Good thermal shock

●        Room temperature cure

Mix Ratio by weight

100:4 Resin to Hardener

Substrates

Metal, Glass, aluminum, steel, bronze, nickel, ceramic and Etc.

Operating Temperature

–40°C (-40°F) to +175°C (347°F)

Typical Applications

· Adhesive for die attach and SMDs onto the hybrid circuits.

· Resisting oxidation and electro-migration in high-reliability micro-electronics.

 

 

UNCURED PROPERTIES:

 

Viscosity @ 25 °C cps

600,000±50,000

Specific Gravity gm/cc

Mixed: 5.15

Reactive solids contents, %

100

Pot Life to double the viscosity

45 minutes at 25°C (77°F)

Particle Size:

≤ 50 Microns

CURE SCHEDULE:

 

24 hours

At 25°C (77°F)

3 hours

At 65°C (149°F)

1 hour

At 100°C (212°F)

 

CURED PROPERTIES:

 

Hardness, Shore D

87

Water Absorption

0.18% after 24 hours

Volume Resistivity ohm. cm

≤ 0.0009

Lap Shear Strength alum to alum, PSI

1700

 

GENERAL INFORMATION:

For safe handling information on this product, consult the

Safety Data Sheet, (SDS).

HOW TO USE:

  1. Carefully clean and dry all surfaces to be bonded.
  2. Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
  3. Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
  4. Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
  5. Allow the product to cure according to the cure schedule.

 

AVAILABILITY:

This epoxy can be supplied in many different packages.

 

 

Data Sheets: TDS | MSDS available upon request.