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PRODUCT DESCRIPTION:
AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic high reliability applications.
AA-BOND G298 is non-oxidizing and prevents electromigration.
PRODUCT PROPERTIES:
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Color
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Part A (Resin): Brown
Part B (Hardener): Clear to yellowish
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Cure Type
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Room Temperature or Heat cure
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Benefits
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● No electromigration
● Antioxidation
● Good thermal shock
● Room temperature cure
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Mix Ratio by weight
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100:4 Resin to Hardener
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Substrates
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Metal, Glass, aluminum, steel, bronze, nickel, ceramic and Etc.
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Operating Temperature
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–40°C (-40°F) to +175°C (347°F)
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Typical Applications
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· Adhesive for die attach and SMDs onto the hybrid circuits.
· Resisting oxidation and electro-migration in high-reliability micro-electronics.
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UNCURED PROPERTIES:
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Viscosity @ 25 °C cps
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600,000±50,000
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Specific Gravity gm/cc
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Mixed: 5.15
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Reactive solids contents, %
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100
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Pot Life to double the viscosity
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45 minutes at 25°C (77°F)
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Particle Size:
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≤ 50 Microns
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CURE SCHEDULE:
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24 hours
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At 25°C (77°F)
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3 hours
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At 65°C (149°F)
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1 hour
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At 100°C (212°F)
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CURED PROPERTIES:
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Hardness, Shore D
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87
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Water Absorption
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0.18% after 24 hours
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Volume Resistivity ohm. cm
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≤ 0.0009
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Lap Shear Strength alum to alum, PSI
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1700
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GENERAL INFORMATION:
For safe handling information on this product, consult the
Safety Data Sheet, (SDS).
HOW TO USE:
- Carefully clean and dry all surfaces to be bonded.
- Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
- Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
- Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
- Allow the product to cure according to the cure schedule.
AVAILABILITY:
This epoxy can be supplied in many different packages.
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