Technical Product Bulletin
GOLD FILLED ELECTRICALLY AND THERMALLY CONDUCTIVE EPOXY
PRODUCT DESCRIPTION
AA-BOND G298 is a two-component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic high-reliability applications.
AA-BOND G298 is non-oxidizing and prevents electromigration, making it ideal for semiconductor packaging and die attach applications.
PRODUCT PROPERTIES
| Color | Part A (Resin): Brown Part B (Hardener): Clear to yellowish |
| Cure Type | Room temperature or Heat cure |
| Benefits |
|
| Mix Ratio by weight | 100:4 Resin to Hardener |
| Substrates | Metal, glass, aluminum, steel, bronze, nickel, ceramic, and more |
| Operating Temperature, °C | -40 to +175 |
| Typical Applications |
|
UNCURED PROPERTIES
| Viscosity @ 25 °C, cps | 600,000 ± 50,000 |
| Specific Gravity, mixed, g/cc | 5.15 |
| Reactive solids contents, % | 100 |
| Pot Life to double the viscosity | 45 minutes at 25°C (77°F) |
| Particle Size | ≤ 50 Microns |
CURE SCHEDULE
| 24 hours | 25°C (77°F) |
| 3 hours | 65°C (149°F) |
| 1 hour | 100°C (212°F) |
CURED PROPERTIES
| Hardness, Shore D | 87 |
| Water Absorption | 0.18% after 24 hours |
| Volume Resistivity, ohm·cm | ≤ 0.0009 |
| Lap Shear Strength, alum to alum, psi | 1700 |
GENERAL INFORMATION
For safe handling information on this product, consult the Safety Data Sheet, (SDS).
HOW TO USE
- Carefully clean and dry all surfaces to be bonded.
- Apply AA-BOND G298 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
- Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
- Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
- Allow the product to cure according to the cure schedule.
AVAILABILITY
This epoxy can be supplied in various different packages.
Data Sheets: TDS | MSDS available upon request.
