| PRODUCT DESCRIPTION: AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic high reliability applications. AA-BOND G298 is non-oxidizing and prevents electromigration. PRODUCT PROPERTIES: | Color | Part A (Resin): Brown Part B (Hardener): Clear to yellowish | | Cure Type | Room Temperature or Heat cure | | Benefits | ● No electromigration ● Antioxidation ● Good thermal shock ● Room temperature cure | | Mix Ratio by weight | 100:4 Resin to Hardener | | Substrates | Metal, Glass, aluminum, steel, bronze, nickel, ceramic and Etc. | | Operating Temperature | –40°C (-40°F) to +175°C (347°F) | | Typical Applications | · Adhesive for die attach and SMDs onto the hybrid circuits. · Resisting oxidation and electro-migration in high-reliability micro-electronics. | UNCURED PROPERTIES: | Viscosity @ 25 °C cps | 600,000±50,000 | | Specific Gravity gm/cc | Mixed: 5.15 | | Reactive solids contents, % | 100 | | Pot Life to double the viscosity | 45 minutes at 25°C (77°F) | | Particle Size: | ≤ 50 Microns | | CURE SCHEDULE: | 24 hours | At 25°C (77°F) | | 3 hours | At 65°C (149°F) | | 1 hour | At 100°C (212°F) | CURED PROPERTIES: | Hardness, Shore D | 87 | | Water Absorption | 0.18% after 24 hours | | Volume Resistivity ohm. cm | ≤ 0.0009 | | Lap Shear Strength alum to alum, PSI | 1700 | GENERAL INFORMATION: For safe handling information on this product, consult the Safety Data Sheet, (SDS).
HOW TO USE: - Carefully clean and dry all surfaces to be bonded.
- Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
- Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
- Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
- Allow the product to cure according to the cure schedule.
AVAILABILITY: This epoxy can be supplied in many different packages. |
