Technical Product Bulletin
THIXOTROPIC ROOM TEMPERATURE CURE EPOXY ADHESIVE
PRODUCT DESCRIPTION:
AA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical.
AA-BOND FS291 is medium exotherming system exhibits excellent flow and wetting characteristics.
GENERAL PROPERTIES
| Cure Type | Heat cure or Room temperature |
| Benefits | Excellent flow Excellent wetting characteristics Works on a wide variety of substrates |
| Mix Ratio by weight | 100:81 / Resin:Hardener |
| Substrates | Glass, most metals, and variety of plastics |
| Typical Applications | Structural bonding, overhead and vertical applications |
| Pot Life | 45 minutes |
CURE SCHEDULE:
| 1 hour | @ 65°C |
| 24 hours | @ 25°C |
MISC PROPERTIES:
| Volume Resistivity | 2.70e+13 ohm-cm |
| Hardness, Shore D | 78 |
| Lap shear | 3300 psi (Alum to Alum) |
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply AA-BOND FS291 mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
Data Sheets: TDS | MSDS available upon request.
