AA-DUCT 24 Micro Particle Conductive, Silver Epoxy Adhesive, 2 Part Room Temp Cure

$29.99 - $849.99
SKU:
AA-DUCT 24

PRODUCT DESCRIPTION

AA-DUCT 24 is a two components, room temp cure, micro particle filled silver conductive epoxy that was designed for very small applications requiring particle sizes no larger than 2 microns. This high-performance conductive epoxy cures at room temperature or elevated temperatures making it ideally suited for applications requiring the smaller possible conductive particles.

AA-DUCT 24 offers excellent mechanical, electrical, and physical properties at temperatures up to 180°C.

AA-DUCT 24 is a smooth, soft paste that can be applied by hand application, automatic dispensers, screen-printing, transfer or stamping techniques.

AA-DUCT 24 is an electrically conductive adhesive that will form a complete percolation network within 20 micron holes.

PRODUCT PROPERTIES

Color Silver
Cure Type Room temperature or Heat cure
Benefits ● High strength
● Perfect bond
● Cold solder for heat sensitive components
Mix Ratio by weight 100:4 (Resin : Hardener)
Substrates Metal, Glass, aluminum, steel, bronze, nickel, wood, ceramic and Etc.
Operating Temperature –40 to 180°C (356°F)
Typical Applications Electrical, conductive, circuitry, printed circuit board and electronics repair

UNCURED PROPERTIES

Viscosity @ 25 °C cps 100,000 ±10,000
Specific Gravity, mixed 3.40
Reactive solids contents, % 100
Pot Life 30 minutes
Shelf life 6 months in a plastic pouch
1 year in a jar kit

CURE SCHEDULE

24 hours 25°C (77°F)
90 minutes 60°C (140°F)
45 minutes 80°C (176°F)
15 minutes 120°C (212°F)

CURED PROPERTIES

Hardness, Shore D 80
Volume Resistivity ohm. cm 0.002
Lap Shear Strength to alum, PSI 1800

THERMAL PROPERTIES

Thermal Conductivity, w/mK 2.2
Operating Temperature Range –40 to 180°C (356°F)

GENERAL INFORMATION

For safe handling information on this product, consult the Safety Data Sheet, (SDS).

HOW TO USE

  1. Carefully clean and dry all surfaces to be bonded.
  2. Apply AA-DUCT 24 completely mixed epoxy to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
  3. Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container must be thoroughly mixed prior to use.
  4. Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 125°F for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY

This epoxy can be supplied in many different packages.


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