Technical Product Bulletin
HEAT CONDUCTIVE ELECTRICALLY INSULATING COMPOUND
PRODUCT DESCRIPTION
AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards.
AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.
PRODUCT PROPERTIES
| Appearance | Tan |
| Cure Type | Heat cure or Room Temperature |
| Benefits | Fast cure Strong Durable High-impact bonds at room temperature |
| Mix Ratio by weight | 100:23 / Resin:Hardener |
| Substrates | Bonds readily to itself and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and to many other materials |
| Typical Applications | Fiber optic bundles, potting glass fibers and fiber optic connectors |
UNCURED PROPERTIES
| Viscosity @ 25 °C | 12,000 ±1000 (After Mixing) @ Temperature 77.0 °F, 25°C |
| Specific Gravity, mixed | 2.294 |
| Reactive solids contents, % | 100 |
| Pot Life | 5 minutes |
| Shelf life | 1 Year |
THERMAL PROPERTIES
| Glass transition temperature (Tg), | -40°C, 100°F |
| Lap shear strength, psi | 3400 (Alum to Alum) |
| Operating Temperature | -40 to 100 °C |
| Cure Time | 5 minutes |
| CTE, linear | 14.4 µin/in-°F @Temperature 68.0 °F |
| Thermal Conductivity | 0.840 W/m-K 5.83 BTU-in/hr-ft²-°F |
CURE SCHEDULE
| 1 Hour | @ 125°C |
| 3 Hours | @ 65°C |
| 24 Hours | @ 25°C |
MECHANICAL PROPERTIES
| Hardness, Shore D | 79 |
| Adhesive Bond Strength | 3400 psi |
GENERAL INFORMATION
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE
- Carefully clean and dry all surfaces to be bonded.
- Apply the AA-BOND 2156 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
- Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
- Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY
This epoxy can be supplied in various different packages.
Data Sheets: TDS | MSDS available upon request.
