Technical Product Bulletin
THERMALLY CONDUCTIVE ELECTRICALLY INSULATING COMPOUND
PRODUCT DESCRIPTION
AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.
AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.
GENERAL PROPERTIES
| Appearance | Dark Grey |
| Cure Type | Heat cure or Room Temperature |
| Benefits | Strong Durable High impact bonds at room temperature |
| Mix Ratio by weight | 100:7 / Resin: Hardener |
| Typical Applications | Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards |
UNCURED PROPERTIES
| Specific Gravity, mixed | 2.44 |
| Reactive solids contents, % | 100 |
| Pot Life | 30 minutes |
| Shelf life | 1 Year |
THERMAL PROPERTIES
| CTE, linear | 10.0 µin/in-°F @ Temperature 68.0 °F |
| Thermal Conductivity | 6.94 BTU-in/hr-ft²-°F 1.00 W/m-K |
| Glass transition temperature (Tg), °C | 110 °C, 230 °F |
| Operating Temperature | -70 to 110 °C / -94 to 230 °F |
CURED PROPERTIES
| Hardness, Shore D | 90 |
| Dielectric strength, volts/mil | 410 |
CURE SCHEDULE
| 2 – 4 Hours | @ 65°C |
| 24 Hours | @ 25°C |
ELECTRICAL PROPERTIES
| Volume Resistivity | 5.50e+15 ohm-cm 4.00e+13 ohm-cm @ Temperature 212 °F |
| Dielectric Constant | 6.0 @ Frequency 1000 Hz |
| Dielectric Strength | 410 kV/in |
| Dissipation Factor | 0.010 @ Frequency 1000 Hz |
GENERAL INFORMATION
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE
- Carefully clean and dry all surfaces to be bonded.
- Apply AA-BOND 2153 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
- Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
- Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best result.
AVAILABILITY
This epoxy can be supplied in various different packages.
Data Sheets: TDS | MSDS available upon request.
