Technical Product Bulletin
CERAMIC-BOND 1 FAST CURING INDUSTRIAL EPOXY ADHESIVE
PRODUCT DESCRIPTION
Ceramic-Bond 1 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required.
Ceramic-Bond 1 is versatile two-part epoxy system contains no solvents, mixes easily at room temperature, and is suitable for high performance structural bonding applications where the combination of very fast room temperature curing coupled with low shrinkage and excellent mechanical and electrical properties is needed.
Ceramic-Bond 1 develops strong, tough bonds to metals, plastics, concrete, sheetrock, marble, ceramic, rock, tile, plaster, cement, glass and glass fabrics, hardboards and forestry products, ceramics, rubber, masonry materials, and other construction materials.
Ceramic-Bond 1 is an excellent electrical insulator, and provides superior resistance to vapors and gases, water, galvanic action, petroleum fuels, salt solutions, and many other organic and inorganic compounds.
Ceramic-Bond 1 develops significant properties 1 hour after mixing. However, an extended cure of 4-6 hours at 25°C is required for fully matured bonds.
Note: Ceramic-Bond 1 develops a high exotherm. Use immediately after mixing. The exothermic reaction begins within 2 minutes after initiating the mixing step, so have everything ready before mixing.
GENERAL PROPERTIES
| Appearance | Slight haze/ slight straw |
| Cure Type | Room temperature or Heat cure |
| Benefits |
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| Mix Ratio by weight | 100:100 Resin:Hardener |
| Operating Temperature | -60°C to 110°C (-76°F to 230°F) |
| Substrates | Metals, plastics, concrete, sheetrock, tile, marble, ceramic, rock, plaster, cement, glass fabrics, wood, leather and rigid plastics |
| Typical Applications | Structural bonding, ceramic assembly, industrial repairs, electrical insulation applications |
| Pot Life | 5 minutes |
UNCURED PROPERTIES
| Viscosity @ 25°C, mPa∙s (cP) | Thixotropic |
| Solids Content | 100% |
| Specific Gravity, mixed | 1.2 g/cc |
CURE SCHEDULE
| 30 minutes | 65°C (149°F) |
| 2 hours | 25°C (77°F) |
CURED PROPERTIES
| Volume Resistivity | 5.00e+11 ohm-cm |
| Dielectric Constant | 4.8 |
| Dielectric Strength | 410 kV/in |
| CTE, linear | 33.3 μin/in-°F @ RT |
| Hardness, Shore D | 70 |
| Glass Transition Temp, Tg | 25.0°C (77.0°F) |
GENERAL INFORMATION
For safe handling information on this product, consult the Safety Data Sheet, (SDS).
HOW TO USE
- Carefully clean and dry all surfaces to be bonded.
- Apply Ceramic-Bond 1 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
- Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
- Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
- Allow the product to cure according to the cure schedule. Note: Have everything ready before mixing as the exothermic reaction begins within 2 minutes.
AVAILABILITY
This epoxy can be supplied in various different packages.
Data Sheets: TDS | MSDS available upon request.
