AA-BOND EP30AN LOW VISCOSITY THERMALLY CONDUCTIVE 3.6 W/mK ELECTRICALLY INSULATING EPOXY COMPOUND NASA Low Outgassing

$39.99
SKU:
AA-BOND EP30AN-1
AA-BOND EP30AN LOW VISCOSITY THERMALLY CONDUCTIVE 3.6 W/mK ELECTRICALLY INSULATING EPOXY COMPOUND NASA Low Outgassing

Technical Product Bulletin

HIGH PERFORMANCE EPOXY ADHESIVE

 

PRODUCT DESCRIPTION

AA-BOND EP30AN is a two-part epoxy designed for high-performance potting, sealing, coating, and bonding applications. It enhances heat transfer while maintaining excellent electrical insulation. This formulation is a cost-effective alternative to Master Bond® EP30AN and is an ideal candidate for aerospace applications due to its low out-gassing properties.

This epoxy cures at room temperature but can be cured more rapidly at elevated temperatures. AA-BOND EP30AN forms durable, rigid bonds that are resistant to thermal cycling and various chemicals, including water and oils. It performs reliably across a wide temperature range of -55°F to 245°F and has a low coefficient of thermal expansion.

AA-BOND EP30AN is primarily used in applications where thermal conductivity and electrical isolation are critical. It bonds effectively to a variety of substrates, including metals, silica, alumina, other ceramics, glass, and plastics.

GENERAL PROPERTIES

Appearance Grey
Curing Room temperature or Heat cure
Mix Ratio (by weight) 100:10 (Resin: Hardener)
Benefits
  • Strong, durable bonds
  • Resistant to thermal cycling
  • High impact resistance at room temperature
  • Low viscosity for potting applications
  • Good gap-filling capabilities
  • High adhesive strength
  • Good thermal conductivity

TECHNICAL SPECIFICATIONS

UNCURED PROPERTIES

Specific Gravity, mixed 2.44
Reactive Solids Content, % 100
Pot Life 30 minutes
Shelf Life 1 Year

THERMAL PROPERTIES

CTE, linear 15.0 µin/in-°F @ 68°F
Thermal Conductivity 6.94 BTU-in/hr-ft²-°F (3.6 W/mK)
Operating Temperature -55°F to 245°F

ELECTRICAL PROPERTIES

Volume Resistivity 5.50e+14 ohm-cm
(4.00e+13 ohm-cm @ 212°F)
Dielectric Constant 6.2 @ 1000 Hz
Dielectric Strength 420 volts/mil

CURED PROPERTIES

Hardness, Shore D 89
Dielectric Strength 420 volts/mil

CURE SCHEDULE

@ 65°C 2 – 4 Hours
@ 25°C 24 Hours

NASA Outgassing Data

TML 0.82
CVCM 0.02
WVR 0.15

GENERAL INFORMATION

For safe handling information on this product, please consult the Safety Data Sheet (SDS).

HOW TO USE

  1. Carefully clean and dry all surfaces to be bonded.
  2. Apply the completely mixed adhesive to the prepared surfaces and gently press them together. Light contact pressure is sufficient for strong, reliable bonds. Maintain contact until the adhesive is fully cured.
  3. Some component separation is common during shipping and storage. For best results, it is recommended to thoroughly mix the contents of the shipping container before use.
  4. Some ingredients in this formulation may crystallize when exposed to low temperatures. A gentle warming cycle of 52°C for 30 minutes before mixing may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved before use for optimal results.

AVAILABILITY

This epoxy is available in various package sizes.

Data Sheets: TDS | MSDS available upon request.

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