AA-BOND EP30AN LOW VISCOSITY THERMALLY CONDUCTIVE 3.6 W/mK ELECTRICALLY INSULATING EPOXY COMPOUND NASA Low Outgassing

PRODUCT DESCRIPTION:

AA-BOND EP30AN is a two part epoxy for high performance potting, sealing, coating and bonding which improve heat transfer while maintaining electrical insulation. This is an alternative better priced offset formulation to -Master Bond® EP30AN.  This low out-gassing compound is an excellent candidate for aerospace applications.  

AA-BOND EP30AN will cure at room temperature or more rapidly at elevated temperatures.

AA-BOND EP30AN is an excellent adhesive/sealant forming durable, rigid bonds that resist to thermal cycling and chemicals including water, oils, etc. over the wide temperature range of -55°F to 245°F. The coefficient of thermal expansion is low.

AA-BOND EP30AN is used in applications where thermal conductivity, electrical isolation properties are required.

AA-BOND EP30AN bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.

GENERAL PROPERTIES:

UNCURED PROPERTIES:

THERMAL PROPERTIES:

CURED PROPERTIES:

CURE SCHEDULE:

ELECTRICAL PROPERTIES:

NASA Outgassing Data:

GENERAL INFORMATION:

For safe handling information on this product, consult the Safety Data Sheet (SDS).

HOW TO USE:

1. Carefully clean and dry all surfaces to be bonded.

2. Apply AA-BOND EP30AN completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely

cured.

3. Some separation of components is common during

shipping and storage. For this reason, it is recommended

that the contents of the shipping container be thoroughly mixed prior to use.

4. Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best result.

AVAILABILITY:

This epoxy can be supplied in many different packages.