Electrically Insulating

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AA-BOND FDA15 Food & Drug Administration Medical Grade Epoxy Adhesive

Technical Product Bulletin FOOD AND DRUG APPLICATION EPOXY ADHESIVE PRODUCT DESCRIPTION: AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of...

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AA-BOND F162 High Temp, Fast Cure, Low Visc, 2 Part Fiberoptics Epoxy Ahesive

Technical Product Bulletin Fiber optic Thermally Conductive Electrically Insulating Epoxy Adhesive PRODUCT DESCRIPTION: AA-BOND F162 is a thixotropic electrical insulating epoxy adhesive system with low vapor pressure and outgassing...

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AA-BOND EP30AN LOW VISCOSITY THERMALLY CONDUCTIVE ELECTRICALLY INSULATING EPOXY COMPOUND

PRODUCT DESCRIPTION: AA-BOND EP30AN is a two part epoxy for high performance potting, sealing, coating and bonding which improve heat transfer while maintaining electrical insulation. This is an alternative better pricedoffset formulation to...

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AA-BOND 2156 Heat Conductive, Electrically Insulating, Thermally Conductive, 2 part

Technical Product Bulletin HEAT CONDUCTIVE ELECTRICALLY INSULATING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor,...

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AA-BOND 2153 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic

Technical Product Bulletin THERMALLY CONDUCTIVE ELECTRICALLY INSULATING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy. It is used for staking transistors, diodes, resistors, integrated...

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AA-BOND 2123 Steel Metal Repair Epoxy Adhesive, 2 part, versatile

PRODUCT DESCRIPTION: AA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. AA-BOND 2123 is easy-to-use adhesive...

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AA-BOND 2116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing

Technical Product Bulletin LOW VAPOR PRESSURE EPOXY STAKING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics,...

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AA-BOND 2115 Laser Manufacturing High Impact Optically Clear Epoxy Adhesive

Technical Product Bulletin Laser Manufacturing High Impact Clear Epoxy PRODUCT DESCRIPTION: AA-Bond 2115 is low viscosity epoxy formulation used in the fabrication of lasers. AA-Bond 2115 is an optical clear epoxy where alignment...

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AA-BOND 2113 Clear Low Viscosity, 2 Part, Epoxy Adhesive, Solvent Free, Room Temperature Cure

Technical Product Bulletin CLEAR LOW VISCOSITY EPOXY ADHESIVE PRODUCT DESCRIPTION: AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting...

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AA-BOND 2112-BK Rigid Black Epoxy Encapsulation Compound, 2 Part, staking Room Temp or Heat Cure

Technical Product Bulletin RIGID STAKING COMPOUND EPOXY ADHESIVE PRODUCT DESCRIPTION: AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications...

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AA-BOND 2112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure

Technical Product Bulletin RIGID STAKING COMPOUND EPOXY ADHESIVE PRODUCT DESCRIPTION: AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications...

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AA-BOND 2106T Fast Cure Thixotropic Epoxy Adhesive

Technical Product Bulletin Fast Cure Thixotropic Epoxy Adhesive PRODUCT DESCRIPTION:   AA-BOND 2106T is a two parts epoxy recommended for lower temperature where fast curing required. AA-BOND 2106T is a solvent-free, mixes easily at room...