Potting and Encapsulation

Capcure 3-800 Mercaptan / PM 800 In Stock Ship in 24 hours

This is mercaptan capcure 3-800 / PM 800.  New batch ready to ship within the week and usually same day..   A mercaptan-terminated polymer used as a liquid curing agent with unique rapid-cure characteristics for epoxy resins at...

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AA-BOND EP30AN LOW VISCOSITY THERMALLY CONDUCTIVE ELECTRICALLY INSULATING EPOXY COMPOUND

PRODUCT DESCRIPTION: AA-BOND EP30AN is a two part epoxy for high performance potting, sealing, coating and bonding which improve heat transfer while maintaining electrical insulation. This is an alternative better pricedoffset formulation to...

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AA-BOND 2156 Heat Conductive, Electrically Insulating, Thermally Conductive, 2 part

Technical Product Bulletin HEAT CONDUCTIVE ELECTRICALLY INSULATING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor,...

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AA-BOND 2153 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic

Technical Product Bulletin THERMALLY CONDUCTIVE ELECTRICALLY INSULATING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy. It is used for staking transistors, diodes, resistors, integrated...

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AA-BOND 2116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing

Technical Product Bulletin LOW VAPOR PRESSURE EPOXY STAKING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics,...