Potting and Encapsulation

Atom Adhesives

AA-BOND K5NA Ablative Thermal Compound Adhesive

Technical Product Bulletin  Ablative Thermal Compound Adhesive PRODUCT DESCRIPTION: AA-BOND K5NA is a three-part thermal compound, cures at room temperature widely used for critical aerospace applications because of its superior ablative...

Capcure 3-800 Mercaptan / PM 800 In Stock Ship in 24 hours

This is mercaptan capcure 3-800 / PM 800.  New batch ready to ship within the week and usually same day..   A mercaptan-terminated polymer used as a liquid curing agent with unique rapid-cure characteristics for epoxy resins at...

Atom Adhesives

AA-BOND EP30AN LOW VISCOSITY THERMALLY CONDUCTIVE ELECTRICALLY INSULATING EPOXY COMPOUND

PRODUCT DESCRIPTION: AA-BOND EP30AN is a two part epoxy for high performance potting, sealing, coating and bonding which improve heat transfer while maintaining electrical insulation. This is an alternative better pricedoffset formulation to...

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AA-BOND 2156 Heat Conductive, Electrically Insulating, Thermally Conductive, 2 part

Technical Product Bulletin HEAT CONDUCTIVE ELECTRICALLY INSULATING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor,...

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AA-BOND 2153 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic

Technical Product Bulletin THERMALLY CONDUCTIVE ELECTRICALLY INSULATING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy. It is used for staking transistors, diodes, resistors, integrated...

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AA-BOND 2116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing

Technical Product Bulletin LOW VAPOR PRESSURE EPOXY STAKING COMPOUND PRODUCT DESCRIPTION: AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics,...

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AA-BOND 2115 Laser Manufacturing High Impact Optically Clear Epoxy Adhesive

Technical Product Bulletin Laser Manufacturing High Impact Clear Epoxy PRODUCT DESCRIPTION: AA-Bond 2115 is low viscosity epoxy formulation used in the fabrication of lasers. AA-Bond 2115 is an optical clear epoxy where alignment...

Atom Adhesives

AA-BOND 2113 Clear Low Viscosity, 2 Part, Epoxy Adhesive, Solvent Free, Room Temperature Cure

Technical Product Bulletin CLEAR LOW VISCOSITY EPOXY ADHESIVE PRODUCT DESCRIPTION: AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting...

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AA-BOND 2112-BK Rigid Black Epoxy Encapsulation Compound, 2 Part, staking Room Temp or Heat Cure

Technical Product Bulletin RIGID STAKING COMPOUND EPOXY ADHESIVE PRODUCT DESCRIPTION: AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications...

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AA-BOND 2112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure

Technical Product Bulletin RIGID STAKING COMPOUND EPOXY ADHESIVE PRODUCT DESCRIPTION: AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications...

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AA-BOND 2110 High Impact Epoxy Adhesive Staking Compound, 2 Part, Thixotropic, Non-drip

Technical Product Bulletin HIGH IMPACT EPOXY STAKING COMPOUND ROOM TEMPERATURE CURE PRODUCT DESCRIPTION: AA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and...

Atom Adhesives

AA-BOND 2106T Fast Cure Thixotropic Epoxy Adhesive

Technical Product Bulletin Fast Cure Thixotropic Epoxy Adhesive PRODUCT DESCRIPTION:   AA-BOND 2106T is a two parts epoxy recommended for lower temperature where fast curing required. AA-BOND 2106T is a solvent-free, mixes easily at room...