Technical Product Bulletin
Ceramic-Bond 24 Epoxy Adhesive Strongest Bonding Agent 24 hour Adhesion
Ceramic-Bond is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength.
Ceramic-Bond contains a thixotrophic agent which impedes thinning out of the material during heat cure when properly mixed and cured.
|Cure Type||Room temperature or Heat Cure|
|Benefits||Room temperature or Heat Cure |
Tough enamel like cure
Bonds to a variety of substrates
|Mix Ratio by weight||100:100 / Resin:Hardener|
|Substrates||Metals, glass, ceramics, wood and many plastics|
|Operating Temperature||-60 to 163 °C|
|Typical Application(s)||Staking components, bonding, laminating and repair applications|
|Specific Gravity, mixed||1.07|
|Reactive solids contents, %||100|
|Pot Life||60 minutes|
|4 to 6 hours||@ 65°C|
|24 hours||@ 25°C|
|Shelf Life||2 years closed packaging|
|Glass Transition Temp, Tg||93°C|
|Hardness, Shore D||78|
|Lap shear||2900 psi (Alum to Alum)|
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply Ceramic-Bond completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.
Data Sheets: TDS | MSDS available upon request.