PRODUCT DESCRIPTION: AA-BOND PC12 is a two part bonding adhesive 100 percents solids, designed for coating most types of military printed circuit requirements. This product is an offset of HYSOL™ PC1200-007M.
UNCURED PROPERTIES:
CURING SCHEDULE:
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CURED ELECTRICAL PROPERTIES:
GENERAL INFORMATION: For safe handling information on this product, consult the Safety Data Sheet (SDS). HOW TO USE: 1. Carefully clean and dry all surfaces to be bonded or coated 2. Warm Resin and Hardener to 30º - 40ºC (86º - 104ºF), then mix thoroughly and apply vacuum to remove the bubble with agitation (28 inches of mercury or better) for 5 to 10 minutes. Allow to stand for 30 minutes. Immerse the clean printed circuit board in AA-BOND PC12 at room temperature. The run-off is approximately 65 % to 70% resulting in 2 to 5 mil film thickness. 3. Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary.
AVAILABILITY This epoxy can be supplied in many different packages. Ships within 48 hours.
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Data Sheets: TDS | MSDS available upon request.
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.