AA-BOND PC12 is a two part bonding adhesive 100 percents solids, designed for coating most types of military printed circuit requirements. This product is an offset of HYSOL™ PC1200-007M.
CURED ELECTRICAL PROPERTIES:
For safe handling information on this product, consult the Safety Data Sheet (SDS).
HOW TO USE:
1. Carefully clean and dry all surfaces to be bonded or coated
2. Warm Resin and Hardener to 30º - 40ºC (86º - 104ºF), then mix thoroughly and apply vacuum to remove the bubble with agitation (28 inches of mercury or better) for 5 to 10 minutes. Allow to stand for 30 minutes. Immerse the clean printed circuit board in AA-BOND PC12 at room temperature. The run-off is approximately 65 % to 70% resulting in 2 to 5 mil film thickness.
3. Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary.
This epoxy can be supplied in many different packages. Ships within 48 hours.
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.