AA-BOND PC12 Military Equipment and Circuit Board Coating

$39.99 - $3,499.00
SKU:
AA-BOND PC12

PRODUCT DESCRIPTION:

AA-BOND PC12 is a two part bonding adhesive 100 percents solids, designed for coating   most  types of military  printed circuit  requirements.  This product is an offset of HYSOL™ PC1200-007M.

 

Appearance

Clear to Amber

Cure Type

RT  and  Heat cure

Benefits

·   Continuous operation up to 123 °C

·  Meet military requirements

·  No Cracking over 1/8 “Diameter.

·  Non nutrient

Mix Ratio by weight

100:80 / Resin: Hardener

Substrates

Most types of metals, aluminum, plastics, acrylic,  or almost any thermoplastic substrate.

Operating Temperature

-20 to 125 °C

Typical Application

Automotive, Medical, Aerospace, Photonic,

Assembly, industries, Also can be used anywhere that requires coating for circuits parts.

 

UNCURED PROPERTIES:

Viscosity  

Resin: 700 Cps at 25°C

Hardener: 50000 CPS at 40°C

Density  Lb/Gal

Resin :  9.44

Hardener: 8.3

Reactive solids contents, %

100

Pot Life

4 hours

 

CURING SCHEDULE:

at room temperature

24 to 48 hours

65 °C

4 to 5 hours

75 °C

2 to 3 hours

CURED ELECTRICAL PROPERTIES:

Insulation resistance, ohms (1-3 mil film) at 25 °C

1 x 1014

Insulation resistance, ohms (1-3 mil film) at 65 °C 4th cycle

0.5 x 1010

Insulation resistance, ohms (1-3 mil film) at 65 °C 10th cycle

0.5 x 1010

Dielectric Constant 100Hz @25°C

5.39

Dielectric Constant 100KHz @25°C

4.15

Dielectric Strength volt/ mil 

1,500

Dissipation Factor 100 Hz @25°C

0.11

Dissipation Factor 100 KHz @25°C

0.045

 

 

Volume Resistivity   @25°C ohm-cm

1.0 x1014

 

 

GENERAL INFORMATION:

For safe handling information on this product, consult the Safety Data Sheet (SDS).

HOW TO USE:

1.       Carefully clean and dry all surfaces to be bonded or coated

2.  Warm Resin and Hardener to 30º - 40ºC (86º - 104ºF), then mix thoroughly and apply vacuum to remove the bubble with agitation (28 inches of mercury or better) for 5 to 10 minutes. Allow to stand for 30 minutes. Immerse the clean printed circuit board in AA-BOND PC12 at room temperature. The run-off is approximately 65 % to 70% resulting in 2 to 5 mil film thickness. 

3. Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary.

 

AVAILABILITY

This epoxy can be supplied in many different packages.  Ships within 48 hours.

 

 

Data Sheets: TDS | MSDS available upon request.

 

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.