Technical Product Bulletin
THIXOTROPIC EPOXY/POLYAMIDE ADHESIVE
AA-BOND FS227 is a thixotropic polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting, toughness, and superior mechanical properties are required.
|Cure Type||Heat cure or Room temperature|
|Benefits||High fill |
|Operating Temperature||-60 to 110 °C|
|Substrates||Most material surfaces, including many metals, rigid plastics, glass, ceramics, leather, rubber, wood and concrete|
|Viscosity @ 25 °C||650|
|Specific Gravity, mixed||1.12 g/cc|
|Pot Life||75 minutes|
|4 hours||@ 65°C|
|24 hours||@ 25°C|
|Volume Resistivity||1.20e+14 ohm-cm|
|Dielectric Strength||460 volts/mil|
|Glass Transition Temp, Tg||70°C|
|Dielectric Constant||3.35 @ Frequency 1000 Hz|
|Hardness, Shore D||75|
|Lap shear||2500 psi (Alum to Alum)|
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply the AA-BOND FS227 mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.